Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
Connect the Dots: The Future of Designing for Reality—Pattern Plating
Beyond the Board: The Benefits of Early PCB Engagement in Aerospace and Defense Programs
Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
January 15, 2025 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 8.8% to $5,114.5 million in the third quarter of 2024 from the $4,702.4 million registered in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.7%.
SEMI & ESDA“The electronic design automation (EDA) industry reported significant revenue growth in Q3 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering and Services posted double-digit growth, with Printed Circuit Board and Multi-Chip Module, and Semiconductor Intellectual Property also posting growth. Regionally, the Americas along with Europe, Middle East, and Africa reported double digit growth. The four-quarter moving average increased for all product categories and regions.”
The companies tracked in the EDMD report employed 62,417 people globally in Q3 2024, a 4.5% increase over the Q3 2023 headcount of 59,737, but down 1.2% compared to Q2 2024.
The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns.
Revenue by Product and Application Category – Q3 2024 Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue jumped 16% to $1,922.2 million in Q3 2024. The four-quarter CAE moving average increased 14.5%.
- Integrated Circuit (IC) Physical Design and Verification revenue decreased 5.5% to $854.4 million. The four-quarter moving average for the category increased 4.3%.
- Printed Circuit Board (PCB) and Multi-Chip Module (MCM) revenue rose 5.8% to $450.8 million. The four-quarter moving average for PCB and MCM rose 9.1%.
- Semiconductor Intellectual Property (SIP) revenue increased 7% to $1,686.2 million. The four-quarter SIP moving average rose 17.5%.
- Services revenue rose 45.2% to $200.8 million. The four-quarter Services moving average rose 30.8%.
Revenue by Region – Q3 2024 Year-Over-Year Change
- The Americas, the largest reporting region by revenue, procured $2,325.4 million of electronic system design products and services in Q3 2024, a 17.2% increase. The four-quarter moving average for the Americas rose 17%.
- Europe, Middle East, and Africa (EMEA) procured $645.6 million of electronic system design products and services, a 17.1% increase. The four-quarter moving average for EMEA grew 15.4%.
- Japan’s procurement of electronic system design products and services decreased 3.5% to $298.5 million. The four-quarter moving average for Japan increased 7.6%.
- Asia Pacific (APAC) procured $1,845 million of electronic system design products and services, an 0.7% decrease. The four-quarter moving average for APAC grew 10.6%.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Neways Begins Delivery of Saab’s UTAAS Integrated Sight and Fire Control Systems
02/11/2026 | NewaysNeways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, has started production and delivery of critical sub-systems for Saab’s UTAAS (Universal Tank and Anti-Aircraft System) integrated sight and fire control systems for BAE Systems’ CV90 infantry fighting vehicles.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
02/10/2026 | TrendForceGoogle’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.
Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing
02/09/2026 | QnityQnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/06/2026 | Nolan Johnson, I-Connect007Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.