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Siemens to Accelerate Customer Time to Market with Advanced Silicon IP Through New Alphawave Semi Partnership

02/12/2025 | Siemens
Siemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel.

Strategic Materials Conference 2025 to Highlight the New Era of Materials Innovation

02/12/2025 | SEMI
With advanced materials as a critical enabler of semiconductor growth applications, the Strategic Materials Conference (SMC) 2025 will gather top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest advancements in materials innovation.

LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement

02/11/2025 | LQDX
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.

Incap Slovakia Enhances SMT Quality with Automated Paste Inspection

02/07/2025 | Incap
At Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.

US Air Force Completes First Flight of L3Harris Viper Shield Electronic Warfare System

02/06/2025 | L3Harris Technologies
The L3Harris Technologies all-digital electronic warfare (EW) suite, Viper Shield™, has completed its first flight in a single-seat Block 70 F-16 operated by the 412th Test Wing at Edwards Air Force Base, California.
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