Standard of Excellence: The Power of Personalization in Customer Care
Global Citizenship: Cultural Nuances Around the World
The Government Circuit: Four Things to Know About IPC Advocacy in 2025
KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop
January 22, 2025 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.
With the continued rise in demand for high-performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
The iMAPS Wire Bonding 2025 Workshop and Tabletop Exhibition is an advanced technical workshop presenting a unique forum to unite scientists, engineers, manufacturing, academia and others working in Wire Bonding. The workshop was established to provide a platform for presentations and debate regarding the latest technologies and applications of Wire Bonding use in battery pack, semiconductor, and microelectronic packaging.
Share on:
Suggested Items
Incheon National University Study Pioneers Breakthrough in Wireless Charging Technology
02/21/2025 | PRNewswireThe efficiency of wireless charging systems is limited by power loss occurring due to frequency changes in the resonant circuits that enable power transfer.
Redwire Wins Follow-on Contract to Deliver Third Mako Spacecraft for U.S. Space Force
02/11/2025 | BUSINESS WIRERedwire Corporation, a leader in space infrastructure for the next generation space economy, announced it has been awarded a contract by Orion Space Solutions to deliver a Mako spacecraft to support Tetra-6, a U.S. Space Force (USSF) Space Systems Command (SSC) mission.
Amphenol Completes Acquisition of OWN and DAS Businesses From CommScope
02/05/2025 | BUSINESS WIREAmphenol Corporation announced it had completed the acquisition of CommScope’s (NASDAQ: COMM) Outdoor Wireless Networks (OWN) and Distributed Antenna Systems (DAS) businesses.
Harnessing Knowledge: A New IPC Course Now Available
01/27/2025 | Nolan Johnson, I-Connect007Didem Üstün is a mechanical engineer and subject matter expert about military cable design who’s now teaching a wire harness and semiconductor course through IPC. Here, she and Kel Allen, IPCs online instructor-led training manager, discuss the mechanics of the course and why you should consider taking it—especially if you have limited knowledge of wire harness.
TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego
01/09/2025 | TopLineTopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.