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iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
January 23, 2025 | iNEMIEstimated reading time: Less than a minute
Register today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
The transition from 2.5D to 3D packaging technologies like CoWoS, HBM, wafer-to-wafer stacking, and hybrid bonding brings significant challenges in ensuring reliability and performance during testing and inspection. This free iNEMI Packaging Tech Topic Webinar will address these challenges and explore cutting-edge solutions.
Key Webinar Takeaways:
- Evolving requirements in test and inspection for 3D packaging
- Overcoming hurdles in defect detection, alignment accuracy, and high-volume production throughput
- Emerging technologies that future-proof test strategies for 3D packaging
Featured Speaker:
Charlie Zhu, Ph.D., Senior Director of R&D, Nordson ATS
A seasoned technologist with extensive expertise in semiconductor test and inspection
When:
- Thursday, February 13, 2025
- 8:00-9:00 AM EST (U.S.)
- 2:00-3:00 PM CST (Europe)
- 10:00-11:00 PM JST (Japan)
Register Now
Space is limited, so register today to secure your spot. This webinar is open to industry professionals and advance registration is required. Click here to register.
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