Standard of Excellence: The Power of Personalization in Customer Care
Global Citizenship: Cultural Nuances Around the World
The Government Circuit: Four Things to Know About IPC Advocacy in 2025
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
January 23, 2025 | iNEMIEstimated reading time: Less than a minute
Register today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
The transition from 2.5D to 3D packaging technologies like CoWoS, HBM, wafer-to-wafer stacking, and hybrid bonding brings significant challenges in ensuring reliability and performance during testing and inspection. This free iNEMI Packaging Tech Topic Webinar will address these challenges and explore cutting-edge solutions.
Key Webinar Takeaways:
- Evolving requirements in test and inspection for 3D packaging
- Overcoming hurdles in defect detection, alignment accuracy, and high-volume production throughput
- Emerging technologies that future-proof test strategies for 3D packaging
Featured Speaker:
Charlie Zhu, Ph.D., Senior Director of R&D, Nordson ATS
A seasoned technologist with extensive expertise in semiconductor test and inspection
When:
- Thursday, February 13, 2025
- 8:00-9:00 AM EST (U.S.)
- 2:00-3:00 PM CST (Europe)
- 10:00-11:00 PM JST (Japan)
Register Now
Space is limited, so register today to secure your spot. This webinar is open to industry professionals and advance registration is required. Click here to register.
Share on:
Suggested Items
INEMI to Kick Off Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap
02/12/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) will host a webinar on February 13, 2025, at 11:00 a.m. EST (5:00 p.m. CST) to initiate the next phase of development for its Sustainable Electronics Roadmap.
INEMI Launches Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap
02/05/2025 | iNEMIJoin us for an insightful webinar as INEMI kicks off the development of additional content for the Sustainable Electronics Roadmap, focusing on ecological footprint minimization.
The Quest for Perfect Products
11/11/2024 | Marcy LaRont, I-Connect007Anna-Katrina Shedletsky is a former Apple engineer who formed her own company, Instrumental, to address what she felt were frustrating and costly engineering problems and inefficiencies at Apple. She’s passionate about her quest to build perfect products faster than ever before. In this interview, Anna shares her journey from creating innovative products like the Apple Watch to addressing the complexities of failure analysis in manufacturing. She also discusses an upcoming educational webinar she is hosting with Valentina Ratner, CEO of AllSpice.io, for engineering leaders in the manufacturing space. They look forward to providing “real talk” and value to their engineering colleagues.
iNEMI End-of-Project Webinar: Investigation of AI Enhancement to AOI for PCBA
11/06/2024 | iNEMIAutomated optical inspection (AOI) systems are essential in electronic manufacturing for ensuring the quality of printed circuit board assemblies (PCBAs).
EMA Presents Webinar on Designing the Perfect Stackup for Flex
10/25/2024 | EMA Design AutomationJoin the experts at Newgrange Design and EMA to make sure you set your next flex project up for success from the beginning in latest webinar.