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Real Time with... IPC APEX EXPO 2025: Aster—Enhancing Design for Effective Testing Strategies
April 18, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute

Will Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Gardien Services Installs Customized G93 Flying Probe Tester – Largest Test Area in North America/Europe
08/24/2025 | Gardien GroupGardien Group is proud to announce the successful installation of a customized G93 Flying Probe Test Machine at a major manufacturer in North America. This cutting-edge system features the largest test area of any flying probe tester in North America and Europe, setting a new benchmark for PCB testing capabilities.
Meet with The Test Connection Inc. (TTCI) at SMTA Guadalajara 2025
08/18/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce its participation at the upcoming SMTA Guadalajara Expo & Tech Forum, taking place September 17–18, 2025, at Expo Guadalajara, Salón Jalisco Hall D & E.
MoU to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
08/07/2025 | PRNewswireLightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.