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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Uyemura Expands Northeast Sales Team
January 23, 2025 | UyemuraEstimated reading time: Less than a minute
Jason Reese has joined Uyemura as Northeast Regional Sales Engineer. Reese was formerly Technical Sales Manager for Metalor Technologies, a manufacturer of precious metal powders. In that capacity, he focused on metallization solutions for semiconductors, and the medical device sector. Prior, he was Engineering Manager at Vicor Corporation, where he developed processes for the expansion of SM-ChiP components for power modules; he also worked with electrolytic patterning programs.
As a member of Uyemura’s Northeast Support Team, Reese’s responsibilities focus on new program development and field service. He will work from an office in southern New Hampshire, and the company’s Connecticut Tech Center.
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
The Next Generation of Leadership: New Student Board Member Aubrey Smith
04/10/2026 | Marcy LaRont, I-Connect007At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.
ASC Sunstone Circuits Implements Smart Parts Technology at Mulino Facility to Enhance PCB Manufacturing Efficiency
04/09/2026 | ASC Sunstone CircuitsASC Sunstone Circuits, a division of American Standard Circuits, has implemented Smart PartsTM Classics technology at its Mulino, Oregon, manufacturing facility, advancing its commitment to efficient, high-quality PCB fabrication.
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
04/09/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfI just finished "The NVIDIA Way" by Tae Kim, and let me tell you, this isn’t just a book about a semiconductor company. It’s a book about conviction, stubborn vision, and, most of all, what happens when a leader refuses to think small. At the center of it all is Jensen Huang. Kim does a masterful job showing us that NVIDIA’s rise wasn’t luck, timing, or some Silicon Valley fairy dust. It was discipline and obsession. It was long-term thinking in a world addicted to quarterly results.
Meet Emerging Engineer Logan Bistodeau, IBM
04/09/2026 | Michelle Te, I-Connect007When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.