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Advanced Electronics Packaging Digest

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Atomera Breakthrough Targets Broader RF Adoption of GaN-on-Silicon

06/05/2026 | BUSINESS WIRE
Atomera Incorporated, a semiconductor materials and technology licensing company, announced a new approach to GaN-on-Silicon that addresses a key performance barrier limiting its use in mainstream RF applications.

Tight DRAM Supply Boosts Pricing Power, HBM Contract Prices Set to Surge in 2027

06/02/2026 | TrendForce
Sharp increases in conventional DRAM prices since the second half of 2025 have reflected an increasingly tight supply-demand environment.

Imec, EVG Demo Wafer-to-Wafer Hybrid Bonding at 200nm Pitch with Record Overlay Accuracy

05/28/2026 | PRNewswire
This week, at the 2026 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicle with routable interconnects.

IBM, U.S. Department of Commerce Announce America's First Quantum Foundry with $1B CHIPS Award

05/21/2026 | PRNewswire
IBM and the U.S. Department of Commerce (DoC) announced a Letter of Intent (LOI) to build an American quantum chip foundry, securing the nation's global quantum leadership and fueling the country's growing quantum ecosystem.

yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data

05/11/2026 | PRNewswire
Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
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