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Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
January 28, 2025 | Michelle Te, IPC CommunityEstimated reading time: 1 minute
IPC’s Emerging Engineer program provides professionals an opportunity early in their careers to learn from dedicated industry volunteers participating in standards development. Two participants in the program—Brian Chislea, Dow Chemical, mentor to AJ Arriaga, Summit Interconnect—share their experiences in the program in a series of articles. We will follow them through their three years in the mentorship. This is the first in the series.
Name: Brian J. Chislea
Occupation: Scientist and Application Engineer, Dow Chemical
Achievements: 27 years of industrial experience
My expectation for being a mentor: Unlike teaching or presenting, being a mentor is a two-way interaction. As a mentor, you can be both a student and a teacher while networking with peers of similar interests. I find more value in this type of interaction than just presenting a body of work because you can broaden your industry knowledge beyond your area of focus. The IPC Emerging Engineer Program encourages attendance at several networking events and provides dedicated resources for the success of the program. AJ and I will engage in the mentorship program for three years. I feel that’s enough time to see the broad range of activities, build a solid network, and ultimately help AJ start contributing within the IPC community for early career professionals.
Name: Jorge A. (AJ) Arriaga
Occupation: Chemical Process Engineer, Summit Interconnect
Education: Bachelor of Engineering, BE Chemical and Biological Engineering, Biomedical Engineering, Colorado State University
My expectations: I hoped to attend IPC meetings with my mentor and get an inside view of their work and why they’re important. Brian leads a committee, so I thought it would be interesting to see what goes into IPC committees. I also expected to attend some interesting professional development courses and learn together. What I didn’t expect, however, was Brian’s popularity, as he introduced me to many people involved in IPC. It was a great networking experience for me.
Learn more about Brian and AJ in the Winter 2025 issue of IPC Community, where they share some of their professional and personal experience and passions, and how they got involved in the IPC mentorship program. Click here!
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.