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Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
January 28, 2025 | Michelle Te, IPC CommunityEstimated reading time: 1 minute
IPC’s Emerging Engineer program provides professionals an opportunity early in their careers to learn from dedicated industry volunteers participating in standards development. Two participants in the program—Brian Chislea, Dow Chemical, mentor to AJ Arriaga, Summit Interconnect—share their experiences in the program in a series of articles. We will follow them through their three years in the mentorship. This is the first in the series.
Name: Brian J. Chislea
Occupation: Scientist and Application Engineer, Dow Chemical
Achievements: 27 years of industrial experience
My expectation for being a mentor: Unlike teaching or presenting, being a mentor is a two-way interaction. As a mentor, you can be both a student and a teacher while networking with peers of similar interests. I find more value in this type of interaction than just presenting a body of work because you can broaden your industry knowledge beyond your area of focus. The IPC Emerging Engineer Program encourages attendance at several networking events and provides dedicated resources for the success of the program. AJ and I will engage in the mentorship program for three years. I feel that’s enough time to see the broad range of activities, build a solid network, and ultimately help AJ start contributing within the IPC community for early career professionals.
Name: Jorge A. (AJ) Arriaga
Occupation: Chemical Process Engineer, Summit Interconnect
Education: Bachelor of Engineering, BE Chemical and Biological Engineering, Biomedical Engineering, Colorado State University
My expectations: I hoped to attend IPC meetings with my mentor and get an inside view of their work and why they’re important. Brian leads a committee, so I thought it would be interesting to see what goes into IPC committees. I also expected to attend some interesting professional development courses and learn together. What I didn’t expect, however, was Brian’s popularity, as he introduced me to many people involved in IPC. It was a great networking experience for me.
Learn more about Brian and AJ in the Winter 2025 issue of IPC Community, where they share some of their professional and personal experience and passions, and how they got involved in the IPC mentorship program. Click here!
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Brent Fischthal - Koh YoungSuggested Items
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.