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Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States
January 28, 2025 | Koh YoungEstimated reading time: 2 minutes
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry. With more than 24,000 systems installed worldwide, Koh Young has earned its reputation for innovation, accuracy, and reliability in the Surface Mount Technology (SMT) sector. Building on its success in SMT, Koh Young has expanded its advanced inspection and metrology solutions to the semiconductor industry, where it is already well-established in Asia. Now, through this strategic collaboration with NTV, Koh Young is making its metrology and inspection technology available to companies in the U.S. engaged in System-in-Package (SiP), Wafer-Level Packaging (WLP), die stacking, and other advanced packaging applications.
Koh Young has developed the Meister Series and ZenStar, advanced metrology and inspection solutions tailored for the semiconductor industry. These systems are purpose-built to address the demanding requirements of advanced processes:
- Meister S: Designed for inspecting SiP and advanced packaging, the Meister S delivers high-precision 3D solder paste inspection with unparalleled accuracy and repeatability, ensuring superior control and yield optimization.
- Meister D: Built to inspect die and discrete components, the Meister D offers a specialized solution for ensuring product quality and reliability in high-volume semiconductor production environments.
- Meister D+: A dedicated inspection solution combining industry-leading Moiré technology and proprietary optics for highly reflective die applications, the Meister D+ provides capabilities for micro features.
- ZenStar: Koh Young’s wafer-level metrology solution, the ZenStar, delivers wafer metrology using proprietary deep learning technology to inspect defects such as micro-cracks, foreign material, chipping, and more.
Backed by Koh Young’s award-winning support organization and NTV’s expertise, this partnership ensures companies have access to industry-leading inspection systems and local sales support to meet their most demanding requirements. Together, Koh Young and NTV are empowering the semiconductor industry with solutions designed to enhance yield, improve control, and drive innovation.
"NTV is proud to partner with Koh Young to bring its advanced metrology and inspection solutions to semiconductor customers implementing a range of Advanced Packaging technologies," said Dean Turnbaugh, President of NTV. "Koh Young's measurement and inspection technologies, proven in the SMT sector, have been enhanced and tailored to meet the unique challenges of the semiconductor industry. We are eager to introduce these solutions to the U.S. market and support semiconductor manufacturers in achieving higher precision, reliability, and efficiency in their processes."
NTV brings a portfolio of semiconductor-related equipment and decades of experience working with both small and large semiconductor equipment companies and customers across the United States. Koh Young is the latest addition to this portfolio. Together, Koh Young and NTV are well-positioned to support your advanced semiconductor manufacturing needs.
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