-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States
January 28, 2025 | Koh YoungEstimated reading time: 2 minutes
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry. With more than 24,000 systems installed worldwide, Koh Young has earned its reputation for innovation, accuracy, and reliability in the Surface Mount Technology (SMT) sector. Building on its success in SMT, Koh Young has expanded its advanced inspection and metrology solutions to the semiconductor industry, where it is already well-established in Asia. Now, through this strategic collaboration with NTV, Koh Young is making its metrology and inspection technology available to companies in the U.S. engaged in System-in-Package (SiP), Wafer-Level Packaging (WLP), die stacking, and other advanced packaging applications.
Koh Young has developed the Meister Series and ZenStar, advanced metrology and inspection solutions tailored for the semiconductor industry. These systems are purpose-built to address the demanding requirements of advanced processes:
- Meister S: Designed for inspecting SiP and advanced packaging, the Meister S delivers high-precision 3D solder paste inspection with unparalleled accuracy and repeatability, ensuring superior control and yield optimization.
- Meister D: Built to inspect die and discrete components, the Meister D offers a specialized solution for ensuring product quality and reliability in high-volume semiconductor production environments.
- Meister D+: A dedicated inspection solution combining industry-leading Moiré technology and proprietary optics for highly reflective die applications, the Meister D+ provides capabilities for micro features.
- ZenStar: Koh Young’s wafer-level metrology solution, the ZenStar, delivers wafer metrology using proprietary deep learning technology to inspect defects such as micro-cracks, foreign material, chipping, and more.
Backed by Koh Young’s award-winning support organization and NTV’s expertise, this partnership ensures companies have access to industry-leading inspection systems and local sales support to meet their most demanding requirements. Together, Koh Young and NTV are empowering the semiconductor industry with solutions designed to enhance yield, improve control, and drive innovation.
"NTV is proud to partner with Koh Young to bring its advanced metrology and inspection solutions to semiconductor customers implementing a range of Advanced Packaging technologies," said Dean Turnbaugh, President of NTV. "Koh Young's measurement and inspection technologies, proven in the SMT sector, have been enhanced and tailored to meet the unique challenges of the semiconductor industry. We are eager to introduce these solutions to the U.S. market and support semiconductor manufacturers in achieving higher precision, reliability, and efficiency in their processes."
NTV brings a portfolio of semiconductor-related equipment and decades of experience working with both small and large semiconductor equipment companies and customers across the United States. Koh Young is the latest addition to this portfolio. Together, Koh Young and NTV are well-positioned to support your advanced semiconductor manufacturing needs.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Infineon, NIELIT Partner to Strengthen India’s Semiconductor Talent
01/14/2026 | PRNewswireInfineon Technologies AG and the National Institute of Electronics & Information Technology (NIELIT) announced a Memorandum of Understanding (MoU) in Ahmedabad.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
01/14/2026 | I-Connect007The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
Micron Announces Groundbreaking for Historic New York Megafab
01/13/2026 | MicronMicron Technology, Inc. announced that on Jan. 16, 2026, it will officially break ground on its megafab in Onondaga County, New York.
Rising AI-Driven Demand for Power ICs and Capacity Cuts Fuels Potential 8-Inch Foundry Price Hikes
01/13/2026 | TrendForceTSMC and Samsung are cutting 8-inch wafer capacity, pushing global 8-inch capacity to a projected 2.4% year-over-year decline in 2026.
ZDT Strengthens Smart Factory Benchmarking for Semiconductor Manufacturing
01/12/2026 | Zhen Ding TechnologyIn response to the trend of heterogeneous integration between semiconductors and PCBs and the rapid iteration of process technologies, Zhen Ding Tech.