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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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IEC Collaborates with Supply Partners at IPC APEX EXPO 2025
January 29, 2025 | IECEstimated reading time: Less than a minute
In keeping with its company's Supply Chain Motto of Collaboration – Innovation – Quality – Dedication, International Electronic Components, Inc. is excited to announce its collaboration with five other companies at the upcoming IPC APEX EXPO 2025.
IEC will be sharing a booth (#3938) with the following Supply Partners: Pluritec, Eternal Technology Corporation, RBP Chemical Technology, Inc., Sigma-Mecer, and SUSS MicroTec.
Suggested Items
Candor Elevates PCB Fabrication Services with Continued Facility Upgrades
04/28/2025 | Candor CircuitsOntario-based circuit board manufacturer, Candor Circuit Boards has recently completed a series of facility upgrades to improve their PCB offerings. These investments will allow Candor to provide higher volumes of complicated boards more efficiently with better yield. The new technology has allowed the company to take on exciting high technology projects and collaborations in industries such as Military and Aerospace, Medical, Energy and more.
Tandem Panel Shipments to Jump Again to 36% in 2026
04/25/2025 | BUSINESS WIREAccording to recent display industry research from Omdia, tandem RGB penetration into the OLED tablet and notebook panel markets surged from almost zero to more than 30% in 2024.
Mitsubishi Electric, Nanofiber Quantum Technologies Launch Trial to Develop Quantum Computer Interconnection Technology
04/25/2025 | BUSINESS WIREMitsubishi Electric Corporation and Nanofiber Quantum Technologies Inc. (NanoQT) announced today the immediate launch of a joint demonstration aimed at establishing interconnection technologies for neutral-atom quantum computers.
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
Amtech Boosts Capabilities with New SMT Lines and Advanced Batch Washing System
04/25/2025 | AmtechAmtech Electrocircuits, a leading provider of manufacturing solutions, has announced a major upgrade to its production capabilities with the installation of multiple new SMT (Surface Mount Technology) lines and a state-of-the-art batch washing system.