-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
DesignCon 2025: Looking Great at 30
January 30, 2025 | Andy Shaughnessy, Design007Estimated reading time: 1 minute
DesignCon may be turning 30 this year, but the Silicon Valley staple doesn’t look a day over 25. Attendees turned out for this celebratory bash, many of them reminiscing about their first DesignCon event 20 or 30 years ago.
The Tuesday night welcome reception was basically a 30th birthday bash, sponsored by Mouser. Show managers went all out, with strobe lights and a DJ blasting a mix of old and new dance tunes. That was fitting, because I spoke with engineers from ages 21 to 81 at DesignCon this year. Nice to see more younger folks each year.
On Wednesday morning, NVIDIA’s John Linford gave a keynote presentation to a packed room, with attendees standing on the stairs, along the back wall, and anywhere they could find a spot in the Elizabeth A. Hangs auditorium. “The Transformative Power of Accelerated Computing and AI” focused on the many innovations possible with AI, now and in the near future. He showed an example of design modeling of an automobile’s aerodynamic “fluid flow” in a virtual wind tunnel, which can now leverage real-life data. The digital twin is becoming mainstream.
Traffic on the show floor stayed busy for most of Wednesday. This year’s event seemed to be at least as busy as last year’s, which was the biggest show since the days before COVID. Show mascot Chiphead posed for photos throughout the day.
AI was the topic all over the conference and the expo hall, from manufacturing and supply chain optimization to EDA tools. JITX founder Duncan Haldane describes the company’s tools as “code-based AI-driven” design software, and he cites the acceleration of design cycles up to 30x. AI is definitely here to stay.
Let’s all wish DesignCon a happy birthday, and raise a toast to 30 more years as Silicon Valley’s destination for electronics desginers.
Marcy LaRont, managing editor of PCB007 Magazine, wrote a review of the keynote address and some technical sessions. Read the review here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
A 60-Year Legacy of PCB Innovation from IEC
04/17/2026 | Real Time with... APEX EXPOChris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
Take the Mic: Smart and Flexible SMT Solutions from Essemtec
04/03/2026 | Real Time with... APEX EXPOEssemtec is known for naturally adaptive machines inspired by nature and designed for advanced HDI as well as package substrate manufacturing. Pierre-Jean Cancalon discusses new 2K dispensing and high-speed solder paste jetting technologies, perfect for NPI prototyping and flexible production environments.