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Everspin Technology, Lattice Semiconductor Collaborate

02/20/2025 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, today announced that its PERSYST MRAM is now validated for configuration across all Lattice Semiconductor Field Programmable Gate Arrays (FPGA).

Global Semiconductor Manufacturing Industry Reports Solid Q4 2024 Results

02/18/2025 | SEMI
The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the key industry segments, SEMI announced in its Q4 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights.

SK Telecom, SK hynix and Penguin Solutions Sign Collaboration Agreement for AI Data Center Solutions

01/14/2025 | SK Telecom
SK Telecom announced that it has signed a collaboration agreement with SK hynix and Penguin Solutions to pursue joint research, development, and business promotion of artificial intelligence data center (AIDC) solutions.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5

12/23/2024 | I-Connect007 Editorial Team
Chapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
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