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Building on DesignCon’s 30th Anniversary Momentum

02/04/2025 | Marcy LaRont, I-Connect007
With three decades of technological advancements, DesignCon has established itself as a premier conference for electronics design. Susan Deffree, the group event coordinator, reflects on the event's rich history and the exciting developments for its 30th anniversary.

DesignCon 2025, Day 2: It’s All About AI

01/30/2025 | Marcy LaRont, I-Connect007
It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.

Altus to Highlight Key Manufacturing Solutions and Trends at Southern Manufacturing & Electronics 2025

01/15/2025 | Altus Group
Altus Group, a leading distributor of advanced electronics manufacturing equipment in the UK and Ireland, will showcase a selection of cutting-edge solutions at Southern Manufacturing and Electronics 2025 from 4-6 February at the Farnborough International Exhibition Centre..

Fein-Lines: CES 2025—The Consumer Technology Association's Super Event

01/07/2025 | Dan Feinberg -- Column: Fein-Lines
The Consumer Electronics Show, better known simply as CES 2025, starts today, Jan. 7, and continues to Jan. 10 in Las Vegas with an expected attendance of 150,000 tech enthusiasts and innovators. This highly anticipated annual show is a preview of the amazing technology advancements and devices we can expect to see over the next few years.

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
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