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FTG Completes New Banking Agreement
January 31, 2025 | Globe NewswireEstimated reading time: Less than a minute
Firan Technology Group Corporation announced that is has completed a new 3-year banking agreement with BMO Corporate Finance, which matures December 11, 2027, and which includes the following features:
- Committed revolving operating loan facility of USD $10.0M and committed revolving term credit facility of USD $10.0M
- Accordion facility of USD $15.0M in support of acquisitions
- Ancillary credit products for foreign currency hedging, precious metals hedging and credit cards
Jamie Crichton, Vice President and CFO, FTG Corporation stated “The new banking agreement with BMO Corporate Finance provides FTG with improved flexibility and reduced costs to support growth of our current operations and corporate development objectives. We look forward to working with the BMO Corporate Finance team”.
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Safran Invests in mirSense, a French Startup Pioneering Quantum-cascade Lasers
04/30/2025 | SafranSafran, through its Safran Corporate Ventures investment subsidiary, has invested in mirSense, a French startup specializing in quantum-cascade lasers (QCLs).
IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President
04/16/2025 | IPCIPC, the global electronics association, announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth.
Foxconn Distinguished As Member of S&P Global’s Sustainability Yearbook 2025
03/26/2025 | FoxconnHon Hai Technology Group has been distinguished for the first time in S&P Global’s Sustainability Yearbook 2025, a milestone ranking that demonstrates the corporate sustainability strength of the world’s largest electronics manufacturing service provider.
IPC Honors Shennan Circuits Company and Foxconn with Corporate Recognition Awards
03/20/2025 | IPCIPC presented its highest corporate honors to two IPC member companies, Shennan Circuits Company (SCC) and Foxconn, during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2025.
Technica USA Expands Partnership with ASMPT to Southern California and Southern Nevada
02/05/2025 | Technica USATechnica USA is pleased to announce the expansion of its long-standing partnership with ASMPT, a global leader in hardware and software solutions for the electronics manufacturing and semiconductor industries. This expansion extends Technica USA’s representation of ASMPT into Southern California and Southern Nevada.