-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
ioTech’s io600 Wins Prestigious EIC Accelerator Award for Semiconductor Innovation
January 31, 2025 | ioTechEstimated reading time: 1 minute
Reophotonics Ltd, a member of the ioTech group, is proud to announce it has received the highly prestigious EIC Accelerator Award from the European Innovation Council (EIC) and SMEs Executive Agency (EISMEA). This recognition highlights the transformative impact of the io600 Digital Deposition System on semiconductor manufacturing.
The EIC jury praised the io600 as a “game-changer,” citing its ability to strengthen and scale up production and innovation across Europe’s semiconductor value chain. This award aligns with the ambitious objectives of the European Chips Act, which aims to bolster Europe’s competitiveness in the global semiconductor market through innovation, sustainability, and advanced manufacturing capabilities.
“The io600 responds to market needs,” the jury stated. “It will enable further miniaturization, realize features and structures currently impossible to manufacture” and “it will significantly increase throughput, yield, and sustainability.”
By addressing these critical industry challenges, the io600 empowers manufacturers to unlock faster, more accurate, and environmentally friendlier production processes. Its ability to create structures that traditional methods cannot produce marks a significant step forward for semiconductor innovation.
“This award testifies to our commitment to push the boundaries of semiconductor packaging,” said Hervé Javice, CEO of ioTech Reophotonics. “The cutting-edge io600 is perfectly aligned with the objectives of the European Chips Act, and we are proud to play a key role in strengthening Europe’s semiconductor capabilities.”
Reophotonics congratulates the other award recipients and looks forward to further advancing electronics manufacturing through the io600’s revolutionary technology.
Suggested Items
Drip by Drip: Semiconductor Water Management Innovations
03/05/2025 | IDTechExNot only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest report, “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts”, forecasts water usage across semiconductor manufacturing to double by 2035, as demand for integrated circuits continues to rise.
Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance
03/05/2025 | Globe NewswireThis MoU marks a significant step forward for Tata Electronics, Himax, and PSMC in expanding their market outreach and jointly exploring the growing market of display semiconductors and ultralow power AI sensing in India as well as globally.
U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B
03/05/2025 | TrendForceTrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion.
Semiconductor Climate Consortium Announces Key 2025 Initiatives to Accelerate
03/04/2025 | SEMIThe Semiconductor Climate Consortium (SCC) unveiled its four key initiatives for 2025, marking a significant step forward in advancing the industry’s commitment to decarbonization and transparency.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.