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Advanced Electronics Packaging Digest

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Suggested Items

Don't Buy AI, Learn It: A Fabricator's Guide to Getting Started, Part 1

05/27/2026 | Sean Patterson, CrossGen AI
The first hard truth about AI in PCB fabrication is that you can buy software, but you cannot buy capability. You can sign a contract, schedule demos, put a few logos on a slide, and tell your team you now have an AI strategy. Plenty of companies are doing some version of that right now. But if the people in your plant do not know how to use AI in real work, then your purchase was more akin to buying a gym membership and never going. (Don’t take that as criticism; it’s just how it works.)

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.

Fujitsu Develops Self-Evolving AI Agent Technology for Business Operations

05/25/2026 | JCN Newswire
Fujitsu Limited announced the development of a self-evolving multi-AI agent technology that enables multiple AI agents to perform tasks as a team, continuously and safely learning from daily execution results, human feedback, policy revisions, and specification changes.

San Francisco Circuits Achieves CMMC Level 2 Certification

05/22/2026 | San Francisco Circuits
San Francisco Circuits, Inc., a leading printed circuit board fabrication and assembly supplier serving commercial and defense markets, announced that it has achieved Final Cybersecurity Maturity Model Certification (CMMC) Level 2 status following a successful independent assessment by an accredited Certified Third-Party Assessment Organization (C3PAO).

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/22/2026 | Nolan Johnson, I-Connect007
It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.
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