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Advanced Electronics Packaging Digest

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IBM, Lockheed Martin Launch Quantum Innovation Hub at ETH Zurich

09/13/2026 | Lockheed Martin
IBM and Lockheed Martin, through an offset agreement with armasuisse, Switzerland's Federal Office for Defence Procurement, established a hub for quantum innovation at ETH Zurich, a prominent public research university.

Samsung Electronics, ASML Expand Semiconductor Collaboration

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Samsung Electronics and ASML announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era.

I-Connect007 Observes Labor Day Holiday With Office Closure

09/04/2026 | I-Connect007
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proteanTecs, MegaChips Partner on Health and Performance Solutions for Next-Gen LSIs

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NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power Innovation

09/04/2026 | Siemens
Siemens announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor technologies, has adopted Siemens’ Precision FPGA Synthesis for its field-programmable gate array (FPGA) development initiatives.
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