-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
February 4, 2025 | SolderStarEstimated reading time: 1 minute
Solderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California. The event will highlight Solderstar’s commitment to offering advanced technologies designed to optimize soldering processes and improve product quality.
At the exhibition, Solderstar will showcase its range of profiling solutions, including the Reflow Shuttle O2. Since its launch, it has been highly successful in helping manufacturers improve reflow soldering processes by providing precise control over key parameters such as O2 ppm levels, temperature profiles, vibration and conveyor speed. This results in higher-quality solder joints, reduced defects, and enhanced process efficiency.
Keith Blakeley, Sales Manager at Solderstar, said: “Maintaining precise oxygen levels during reflow soldering is vital for ensuring strong, reliable solder joints. Our Reflow Shuttle with O2 measurement allows manufacturers to track oxygen levels in real time, enabling them to reduce defects caused by oxidation and de-wetting. With this system, manufacturers can optimize nitrogen usage, minimize waste, and enhance overall process efficiency. We are excited to demonstrate how these solutions can make a measurable impact on improving product quality and operational performance.”
Solderstar will also present the SLX thermal profiler, a highly accurate, ultra-compact, and battery-powered datalogger designed for measuring and recording process parameters in soldering processes. The SLX unit offers quick setup with minimal user input, automatically configuring itself when docked onto any SMARTLink reflow heatshield or other process accessories. With features like 2.4 GHz telemetry options, and an impressive 15 hours of profiling time from just a two-hour charge, the SLX ensures high-performance, real-time data capture.
Attendees are invited to visit Solderstar at booth 1120 to find out more about its advanced profiling solutions and discuss how they can optimize their soldering processes.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.