Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Würth Elektronik at embedded world 2025
February 6, 2025 | Wurth ElektronikEstimated reading time: 2 minutes
In addition to new components from the fields of wireless connectivity, power magnetics, optoelectronics and electromechanics, Würth Elektronik will also be presenting a pioneering concept at embedded world from March 11 to 13: Single Pair Ethernet (SPE) with Power over Data Lines (PoDL). At Stand 2-110 in Hall 2 of the Nuremberg exhibition centre, the manufacturer will be presenting the first reference design for an EMC-compliant 10 Mbit/s Ethernet interface, which enables both data transmission and power supply via a single twisted pair of wires.
“With this reference design, we are demonstrating that we not only develop high-quality components for our customers, but we also take care of their optimal use, offering practical and sustainable solutions. Our new reference design helps to reduce cabling costs in industrial and IoT applications. It also reduces weight and saves costs - cutting copper consumption by 50%,” says Alexander Gerfer, CTO of the Würth Elektronik eiSos Group. “Single-pair Power over Ethernet (SPoE) is a space- and material-saving solution. Thanks to our reference design - which we provide including all the design files - it can now be implemented easily, conveniently, standard-compliant and EMC-safe.”
Würth Elektronik's contribution to the embedded world conference program is also dedicated to this topic: Dr. Heinz Zenkner and Adrian Stirn, EMC specialists at the company, will be giving a workshop entitled “Single Pair Ethernet Design with Power over Data Line with EMC Aspects” on 12 March 2025 from 2 to 5 pm.
Component news
At the trade fair in Nuremberg, Würth Elektronik will be presenting Cordelia-I, one of the first wireless modules to comply with the 2022/30 cyber security regulation in accordance with EN18031-1. In the field of storage inductors, for example, the WE-MXGI series is a product that enables maximum efficiency in switching regulator applications. The company's optoelectronics experts will be presenting the expansion of the WL-ICLED range to include dual-wire ICLEDs. The REDEXPERT ICLED Color Calculator is now also available for these RGB LEDs with integrated circuit (IC). This can be used to automatically generate exact PWM signals to display defined color values. Other new products include USB-C components and additional sizes of the popular WE-CNSW current-compensated data line filters.
Würth Elektronik’s subsidiary IQD will be co-exhibiting at the stand with quartz crystals and oscillators. In addition, the semiconductor manufacturers Analog Devices and onsemi will be guests at the stand as partners to present joint reference designs. Würth Elektronik is also once again taking part in the Students Day, which this time takes place on March 13.
Share on:
Suggested Items
Quest Global Acquires Alpha-Numero Technology Solutions
03/14/2025 | Quest GlobalQuest Global is pleased to announce the acquisition of Alpha-Numero Technology Solutions. Alpha-Numero is a US-based VLSI design company with expertise in FPGA.
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.