Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
February 6, 2025 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026. Designed to enhance the reliability and sustainability of high-temperature electronic assemblies, this reworkable edgebond addresses key industry challenges - rising material costs, operational complexity, and the push for more sustainable manufacturing.
Engineered to meet the demands of advanced electronic applications, ALPHA HiTech CF31-4026 is a game-changer for manufacturers looking to enhance product reliability while reducing material waste and lowering overall costs. Ideal for high-reliability applications in automotive electronics and high-performance computing, this solution ensures components endure extreme conditions without compromise.
“High-reliability electronics require robust solutions that not only perform under extreme temperatures but also support sustainable manufacturing practices,” said Tiang Chuan Hng, Global Product Manager for Polymer Reinforcement Adhesives. “ALPHA HiTech CF31-4026 provides exactly that. Its reworkable nature enables manufacturers to rework components without compromising the integrity of the assembly, promoting both cost-effectiveness and sustainability.”
A Breakthrough for Advanced Electronics Assembly
Electronic devices are becoming increasingly complex, with manufacturers facing significant challenges in ensuring product reliability, particularly in demanding environments. ALPHA HiTech CF31-4026 rises to meet these challenges by delivering exceptional thermal cycling performance, improved adhesion, and superior board-level reliability.
With its innovative reworkable design, ALPHA HiTech CF31-4026 provides manufacturers with greater flexibility. It allows for component removal at lower temperatures, starting from 185°C, enabling quick rework and reducing material waste. This makes it an ideal solution for advanced manufacturing applications where both process efficiency and sustainability are integral.
Key Features:
- Thermal performance: High Tg and low CTE deliver superior thermal cycling durability.
- Reworkable design: Reduces total cost of ownership and supports high-yield manufacturing.
- Exceptional bonding: Provides strong adhesion to PCBs, ensuring reliability in critical applications.
- Slump resistance: Maintains component integrity in dense PCB designs.
Manufacturers seeking to optimize the performance of their high-reliability applications can benefit from ALPHA HiTech CF31-4026’s innovative design, which ensures reliability under the most demanding conditions while also addressing critical sustainability concerns. This next-generation edgebond is set to redefine how manufacturers approach board-level reliability and process efficiency in high-performance electronics.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Nortech Systems Incorporated Earns AS9100 Certification for Monterrey, Mexico Facility
11/04/2025 | BUSINESS WIRENortech Systems, Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that its Monterrey, Mexico, facility has achieved AS9100:D certification.
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.