LPMS USA to Offer Live Molding Demos at IPC APEX 2025
February 7, 2025 | LPMS USAEstimated reading time: Less than a minute

LPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.
Low-pressure molding is an innovative, fast, and efficient process that encapsulates, seals, and protects electronics in a single step. Whether you need to waterproof delicate electronics, overmold cable harnesses, or safeguard LEDs, this process speeds up production, lowers environmental impact, and cuts costs compared to traditional potting methods, all while providing reliable protection for your components.
At the event, we’ll showcase the KAPPA 1100H, a compact, operator-friendly machine that prioritizes safety and ease of use. This machine highlights our commitment to delivering high-quality, reliable solutions tailored to meet the demands of modern electronics manufacturing.
Join us at Booth #2300 to explore how LPMS USA can help you streamline production and protect your products.
Suggested Items
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.
IPC APEX EXPO 2025 Review: The New Normal Looks Like the Old Normal
04/16/2025 | Nolan Johnson, SMT007 MagazineMy IPC APEX EXPO, my days are filled with either talking or listening from sunup to sundown. I get to answer questions of some of the brightest minds in the business, while also listening and synthesizing what they’re sharing with me about the current and future state of the industry. Here are five observations based on the conversations.
YINCAE to Showcase Cutting-Edge Solutions at SEMICON Southeast Asia 2025
04/16/2025 | YINCAEYINCAE Advanced Materials, a leading provider of innovative solutions for the semiconductor and microelectronics industries, is proud to announce its participation in SEMICON Southeast Asia 2025.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/16/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.