Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
LPMS USA to Offer Live Molding Demos at IPC APEX 2025
February 7, 2025 | LPMS USAEstimated reading time: Less than a minute
LPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.
Low-pressure molding is an innovative, fast, and efficient process that encapsulates, seals, and protects electronics in a single step. Whether you need to waterproof delicate electronics, overmold cable harnesses, or safeguard LEDs, this process speeds up production, lowers environmental impact, and cuts costs compared to traditional potting methods, all while providing reliable protection for your components.
At the event, we’ll showcase the KAPPA 1100H, a compact, operator-friendly machine that prioritizes safety and ease of use. This machine highlights our commitment to delivering high-quality, reliable solutions tailored to meet the demands of modern electronics manufacturing.
Join us at Booth #2300 to explore how LPMS USA can help you streamline production and protect your products.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.
KYZEN to Highlight High-Reliability MICRONOX Chemistries at SEMICON West 2025
09/08/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation in SEMICON West 2025, taking place October 7–9 at the Phoenix Convention Center in Phoenix, Arizona.