-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Teradyne, Infineon Announce Strategic Partnership to Advance Power Testing
February 11, 2025 | TeradyneEstimated reading time: 1 minute
Teradyne, Inc., a leading supplier of automated test solutions, and Infineon Technologies AG, a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.
As part of the strengthened relationship, Teradyne will acquire part of Infineon’s automated test equipment team (AET) in Regensburg, Germany. This acquisition provides mutual benefits for both companies. With the additional resources and expertise, Teradyne will accelerate its roadmap in the power semiconductor segment while collaborating on new solutions with a key market leader. By entering into a service agreement, Infineon secures continued manufacturing support as well as enhanced flexibility to respond to internal demand for this specialized test equipment, and benefits from Teradyne’s economy of scale. Teradyne is fully committed to the 80-person team at Infineon’s Regensburg site and plans to build upon these capabilities as it integrates together with its Power Semiconductor business unit.
“We are thrilled to enter into this strategic partnership with Infineon," said Rick Burns, President, Semiconductor Test Group at Teradyne. "Acquiring and integrating Infineon’s technology and team in Regensburg will extend our leadership in the power semiconductor market. Infineon’s technology will enhance our market-leading ETS product portfolio, demonstrating our commitment to continue to provide innovative solutions that meet the evolving needs of our customers."
"Together with Teradyne, we are advancing our power semiconductor test capabilities," said Alexander Gorski, Executive Vice President, Frontend Operations at Infineon. "Integrating our experienced workforce with Teradyne will help to accelerate innovation and address the dynamic test challenges in new technologies like silicon carbide and gallium nitride at the scale and flexibility needed by our markets and customers. At the same time, we provide our employees a long-term perspective in a highly specialized company."
Suggested Items
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Fraunhofer IPMS, DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
07/17/2025 | Fraunhofer IPMSThe Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor manufacturing.
TI Honored by Volkswagen Group for Operational Excellence
07/16/2025 | Texas InstrumentsTexas Instruments (TI) received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany.
Report: Broadcom Scraps $1 Billion Chip Investment in Spain
07/15/2025 | I-Connect007 Editorial TeamAmerican chipmaker Broadcom has pulled out of plans to invest in a microchip plant in Spain. According to a July 14 Reuters report, Europa Press, quoting anonymous sources, stated the action followed collapsed government talks but gave no further information.
Siemens Collaborates with SK keyfoundry to Launch 130nm Automotive Power Semiconductor Calibre PERC PDK
07/15/2025 | SiemensSiemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) that is exclusively designed for use in Calibre® PERC™ software.