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3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.

02/04/2025 | PR Newswire
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/31/2025 | Nolan Johnson, I-Connect007
The year is off to a roaring start across the globe, but especially in the U.S. We’ll all be carefully watching the changes in policy, legislation, and enforcement coming out of Washington D.C., in the coming weeks and months. One thing is clear, though. No matter what your opinions or political affiliations are, things will change. That said, it is impossible to look at last week’s news and draw any conclusions about how everything will equilibrate in the end. Frankly, it’s just too soon for that sort of analysis. In the meantime, here are last week’s five top stories. If you’ve read nothing else about the industry this week, read these.

Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States

01/28/2025 | Koh Young
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry.

TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips

01/24/2025 | SCHMID Group
TRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.
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