The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement
February 11, 2025 | LQDXEstimated reading time: 1 minute
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.
ASU is currently at the forefront of advanced semiconductor packaging research and scale-up, and its newly announced Advanced Packaging Piloting Facility (PPF) created via the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) will enable researchers and industry leaders to test new materials, devices, and advanced packaging solutions in a state-of-the-art R&D environment. LQDX will provide ASU with its Liquid Metal Ink (LMIx®) chemistries and process IP and will collaborate with sponsored students and industry partners to qualify cutting-edge US-centric semiconductor packaging solutions within the Arizona ecosystem.
“ASU is the new center of gravity of US semiconductor and packaging innovation, Coupled with the recent CHIPS investments and large-scale manufacturing builds from TSMC and Amkor, there is no better development partner for LQDX. This agreement takes the research partnership we initiated in 2024 to the next level and is focused on the delivery of next generation IC-substrates and advanced semiconductor packaging solutions as enabled by our PVD-in-a-BottleTM technology,” said Simon McElrea, LQDX’ CEO.
Professor Hongbin Yu of Arizona State University stated, “We are delighted to work with LQDX on the development and scaling of their advanced packaging technology at ASU. It is our vision to develop and scale cutting-edge semiconductor technologies that further the economic interests of the State of Arizona and the US as a whole, and we welcome LQDX to the AZ ecosystem.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TSMC Reports Third Quarter EPS of NT$17.44
10/22/2025 | TSMCTSMC announced consolidated revenue of NT$989.92 billion, net income of NT$452.30 billion, and diluted earnings per share of NT$17.44 (US$2.92 per ADR unit) for the third quarter ended September 30, 2025.
Global Electronics Association Releases Fall Schedule of Instructor-led Courses
10/20/2025 | Corey Lynn, Global Electronics AssociationWhether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.