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nVent SCHROFF Introduces Enhanced PCB Extraction in Rugged Environments
February 11, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
nVent SCHROFF plc has unveiled its latest innovation, the Positive Retraction Card-Lok, specifically engineered for the dependable removal of printed circuit boards (PCBs) in rugged environments, aerospace being chief among them. An award winner at electronica in November, this new Card-Lok features a sophisticated mechanism that effectively eliminates stiction, ensuring that it disengages smoothly from the chassis wall during second level maintenance. Boasting improved clamp force and thermal dispensation over standard Card-Loks. This model was designed as a direct replacement and improvement over the nVent SCHROFF 260, 265, and 280 Calmark & Birtcher lines.
Manufactured in a AS9100-certified facility located in San Diego, California, the Positive Retraction Card-Lok complies with VITA standards (46, 48.2, 48.4, 48.5, and 48.8) and meets SOSA standards as well. Additionally, it adheres to DFARS, JOSCAR, and ITAR requirements and boasts advanced specifications for shock and vibration resistance.
nVent SCHROFF has produced a white paper on their new Card-Lok, which can be downloaded at their site.
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