-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Altus Group Strengthens Industry Connections at Southern Manufacturing & Electronics 2025
February 11, 2025 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has concluded another successful year at Southern Manufacturing and Electronics 2025, where the team strengthened relationships with existing customers and engaged with new industry contacts. The event provided an ideal platform to showcase some of the leading-edge solutions in electronics manufacturing and discuss key projects set to shape the industry in 2025 and beyond.
This year, Altus highlighted four key machine processes from its portfolio, featuring advanced solutions from leading suppliers, including, Koh Young’s 3D Automated Optical Inspection (AOI), PVA’s Conformal Coating technology, Asscon’s Vapour Phase Soldering, and Essemtec’s All-in-One SMT Assembly system. Interest was particularly strong in conformal coating and modular SMT assembly, reinforcing a trend that has carried over from 2024.
Joe Booth, CEO of Altus Group said: “I'm always delighted after the Southern show as our stand becomes increasingly busy each year. My only disappointment is missing customers who wanted to connect with us because our team was already engaged in discussions.
“Ultimately, this event is great for catching up with numerous customers in one place and establishing a clear focus on priority projects where we can deliver the greatest value. Our close customers conveyed genuine excitement about the year ahead and emerging stability, further boosted by the promising outlook of declining interest rates, which should support increased investment in their facilities. I'm eager to see this interest translate into technical validations and successful implementations throughout the year."
Altus met with over 100 different UK manufacturing sites across the three-day event, discussing hundreds of live projects slated for 2025 and 2026. This high level of engagement demonstrates the ongoing opportunities within electronics manufacturing and positions the company for another strong year ahead.
A highlight of the show was Joe Booth’s presentation, Every Challenge is an Opportunity with the Right Vision, which explored how manufacturers can turn economic pressures into opportunities for innovation. The session reflected on key projects implemented by Altus in 2024 and provided insights into leveraging automation and advanced manufacturing solutions to navigate market challenges.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference was well received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year is the Design Pavilion and Technology Theater, bringing commercial value to technical discussions and highlighting the critical role of timely standards development in rapidly evolving sectors like AI and automotive.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.