Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Siemens to Accelerate Customer Time to Market with Advanced Silicon IP Through New Alphawave Semi Partnership

02/12/2025 | Siemens
Siemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel.

GlobalFoundries Announces New York Advanced Packaging and Photonics Center

01/24/2025 | GlobalFoundries
GlobalFoundries (GF) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.

Cadence to Acquire Secure-IC, a Leader in Embedded Security IP

01/22/2025 | Cadence Design Systems
Cadence announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider.

Imec Achieves Breakthrough in Silicon Photonics

01/13/2025 | Imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

01/09/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in