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The Test Connection Celebrates Its 45-Year Test and Training Legacy at IPC APEX EXPO 2025

02/20/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its participation in the 2025 IPC APEX EXPO.

BAE Systems Significantly Expands Endicott Operations to Support Aircraft Electrification

02/20/2025 | BAE Systems
BAE Systems, a leading aerospace technology company, is expanding its operations in Endicott, New York, with a 150,000 square feet addition to its existing footprint. The dedicated facility will be equipped for high-voltage energy storage systems (ESS) development, manufacturing, and field support, advancing sustainable aviation solutions.

Arch Systems to Showcase AI-Powered Automated Downtime Labeling at IPC APEX EXPO 2025

02/20/2025 | Arch Systems
Arch Systems, a leader in machine data, AI, and analytics for manufacturers, will exhibit at the 2025 IPC APEX EXPO, taking place from March 18-20 at the Anaheim Convention Center in California. Visitors can explore Arch's latest innovations at Booth #1102, where the company will introduce Arch Systems’ Automated Downtime and its collaborative efforts in global electronics manufacturing.

Fresh PCB Concepts: Traceability in PCB Design

02/20/2025 | Team NCAB -- Column: Fresh PCB Concepts
Traceability has evolved from a safety-critical need in PCB production to a valuable tool across all electronic manufacturing industry sectors. The IPC-1782 standard addresses automated data collection, reduces ownership costs, and ensures accurate, timely information. It provides a flexible data architecture for different levels of traceability, from highly detailed systems (e.g., critical safety systems) to basic traceability needs (e.g., consumer products). The structure avoids data duplication and allows crucial information to be added post-production.

EIPC 2025 Winter Conference: Business Outlook and New EMS Opportunities

02/18/2025 | Pete Starkey, I-Connect007
“Navigating and Optimizing Complex Processes: How to Overcome Today’s and Tomorrow’s Challenges in PCB Processing” was the theme of the 2025 EIPC Winter Conference, held Feb. 4–5, in historic Luxembourg City, the capital of Luxembourg, a small country in the heart of western Europe with borders to Belgium, France, and Germany. EIPC president Alun Morgan welcomed delegates from more than 70 companies in Europe and beyond, and thanked the sponsors of the event. Morgan can always be relied upon for a topical opening presentation. This time, he addressed “Internet of Things: Vulnerabilities and How to Address Them.”
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