The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
February 18, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector.
Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
His new column, “Beyond the Board,” will delve into market and industry trends, workforce engagement, and the processes and technology roadmap within the electronics industry. He will explore a variety of topics, including the future of innovation, electronics and sustainability, how electronics careers are changing the world, breaking stereotypes, and other market trends.
Jesse Vaughan is a third-generation PCB technologist with extensive experience in PCB design, fabrication, assembly, and program management. He has collaborated closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. Jesse excels at bridging the gap between innovation and manufacturability, optimizing complex board designs, and streamlining production processes. His commitment to advancing PCB technology is evident through his active participation in several IPC committees.
He is currently employed as a senior account manager at Summit Interconnect.
We look forward to Jesse’s insightful contributions and are confident that “Beyond the Board” will become a valuable resource. The first column debuts in the I-Connect007 newsletter MilAero007 Week on Tuesday, Feb. 25.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Ibiden Opens Ono Plant to Expand AI Server IC Substrate Production Capacity
10/14/2025 | IBIDENIBIDEN Co., Ltd. announces that it held the opening ceremony for its Ono Plant on October 10, 2025 in Ono Town, Ibi District, Gifu Prefecture. Construction work and preparations for mass production at the plant had been underway.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.
Capital Electro-Circuits Achieves ITAR Registration to Strengthen Aerospace and Defense Capabilities
10/06/2025 | Capital Electro-CircuitsCapital Electro-Circuits, Inc. (CEC), a U.S.-based manufacturer of mission-critical printed circuit boards since 1985, announced that it is now officially registered with the U.S. Department of State, Directorate of Defense Trade Controls (DDTC) under the International Traffic in Arms Regulations (ITAR).