Defense Speak Interpreted: Understanding What the Department of Defense Is, and Isn’t
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
PARMI USA to Unveil Xceed II AOI System at IPC APEX EXPO 2025
February 18, 2025 | PARMI USAEstimated reading time: 2 minutes
PARMI USA, INC., a leader in advanced 3D inspection systems, is excited to announce the launch of its next-generation 3D Automated Optical Inspection (AOI) system, the Xceed II, at the 2025 IPC APEX EXPO, scheduled to take place March 18-20, 2025 at the Anaheim Convention Center in Anaheim, California. The Xceed II will be featured at Booth 910, where PARMI will showcase its latest advancements in inspection technology.
The Xceed II features an enhanced platform designed to improve inspection speed and quality. This new system incorporates the TRSC-II sensor, delivering superior 2D/3D data quality and offering five different resolution settings, from high precision (4 µm, 6 µm, 7 µm) for detailed inspection to high-speed settings (10 µm, 14 µm) for faster throughput.
A key highlight of the Xceed II is its optimization for die inspection, including System in Package (SiP), bare die, IPD, die attach, underfill fillet, and Cu Clip on die. This makes it the ideal solution for inspecting complex components found in next-generation electronics. Additionally, the system enhances 2D die inspection through advanced coaxial lighting, enabling more types of defect detection on the die’s top surface, including text, polarity, cracks, contamination, chipping, and epoxy issues.
“We are excited to showcase the Xceed II at IPC APEX EXPO 2025,” said Juan Arango, Head of Sales and Business Development at PARMI USA. “The improvements in speed, precision, and die inspection optimization make the Xceed II the most advanced AOI system for today’s high-demand, high-precision manufacturing environments.”
Visit PARMI USA at Booth 910
PARMI USA invites industry professionals to experience the Xceed II firsthand at Booth 910 during the upcoming IPC APEX EXPO. Attendees will have the opportunity to explore how the Xceed II can enhance inspection efficiency, reduce defects, and improve production processes.
Visit PARMI at IPC APEX EXPO 2025
Attendees at IPC APEX EXPO 2025 are invited to Booth 910 to learn more about the Xceed II and explore how PARMI's inspection solutions can transform their manufacturing processes.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Express Manufacturing, Inc. Expands Inspection Capabilities with Its 2nd TRI AXI
05/18/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added a new TR7600FB SII from Test Research, Inc., further strengthening its inspection capabilities for complex, high-reliability assemblies.
Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.