Zuken USA Announces Tech Tour 2025 to Highlight the Latest Innovations in Wire Harness and Control Panel Design
February 18, 2025 | ZukenEstimated reading time: 1 minute
Zuken USA is pleased to announce the launch of Tech Tour 2025, a free, one-day event series designed to bring innovation and expertise directly to customers and industry professionals across the United States. The Tech Tour builds upon the legacy of Zuken Innovation World (ZIW), delivering a unique attendee experience tailored for engineers and engineering managers seeking to optimize E3.series-based processes and explore the application of digital engineering solutions.
The Zuken Tech Tour will feature stops in key cities across the U.S., offering attendees access to expert-led sessions, networking, and personalized learning opportunities. With a design process-focused agenda, this event is structured to inspire new ideas, streamline workflows, and foster meaningful industry connections.
Zuken is also pleased to welcome Komax as a sponsor for Tech Tour 2025. Their expertise in wire processing solutions will provide attendees with additional insights into automation and efficiency in harness manufacturing.
Event Highlights
Zuken’s Tech Tour will deliver an exceptional experience for all attendees. Expert-led sessions provide actionable tips and best practices from Zuken’s specialists in harness design and digital engineering. The onsite Expert Bar offers one-on-one guidance from product experts, allowing participants to address specific challenges and gain personalized insights. Additionally, dedicated networking opportunities enable attendees to connect with Zuken’s account teams, product specialists, and peers across the industry.
Locations and Dates:
- San Jose, CA – April 24, 2025 (San Jose Marriott)
- Dearborn, MI – June 5, 2025 (The Henry, Autograph Collection)
- Denver, CO – June 11, 2015, (The View House)
- Pittsburgh, PA – August 20, 2025 (The Westin Pittsburgh)
- Los Angeles, CA – August 27, 2025 (Sonesta Redondo Beach & Marina)
- Chicago, IL – September 10, 2025 (Chicago Marriott Suite O’Hare)
Registration is now open, and attendance is complimentary. Event details, including schedules and resources, are available on the official Tech Tour website.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Eltek Ltd. Reports Strong Second-Quarter 2025 Results
08/14/2025 | PR NewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the quarter ended June 30, 2025.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.