Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Apple to Increase Spend with Broadcom to Produce Billions More U.S. Chips

07/09/2026 | Apple
Apple announced a new multiyear commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies for a wide range of Apple products.

Sony, imec Unveil Backside Connectivity Module for 3D Chip Integration

06/18/2026 | Imec
At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, and Sony Semiconductor Solutions Corporation (Sony) jointly present a novel integration module for highly dense backside interconnects – key components of 3D stacking and backside functionalization technologies.

Kymeta Joins Red Cat Initiative for Maritime Connectivity

05/15/2026 | Globe Newswire
Red Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.

Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

NVIDIA, Corning Partner to Boost U.S. AI Manufacturing

05/06/2026 | BUSINESS WIRE
NVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in