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AIM to Highlight REL61™, W20, and Ultrafine Paste Offerings at Productronica China
February 19, 2025 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China, taking place March 26-28 at the Shanghai New International Expo Center. Among other great products, AIM will showcase its latest innovations in soldering technology, including REL61™, W20 water-soluble solder paste, and ultrafine solder paste solutions.
AIM’s REL61™ alloy, a low-cost SAC305 alternative, provides superior performance across most metrics including thermal fatigue. REL61 is lead-free and versatile – available in bar, wire, and paste.
W20 is a halogen-free, water-soluble solder paste, engineered for excellent printability, cleanability, and reduced voiding. AIM will also highlight its ultrafine solder paste solutions, designed to meet the increasing demand for miniaturization in advanced electronics manufacturing.
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