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BAE Systems Significantly Expands Endicott Operations to Support Aircraft Electrification
February 20, 2025 | BAE SystemsEstimated reading time: 1 minute
BAE Systems, a leading aerospace technology company, is expanding its operations in Endicott, New York, with a 150,000 square feet addition to its existing footprint. The dedicated facility will be equipped for high-voltage energy storage systems (ESS) development, manufacturing, and field support, advancing sustainable aviation solutions.
The expansion underscores BAE Systems’ commitment to the commercial aircraft electrification market segment, positions the company for future growth, and reinforces its dedication to the Greater Binghamton community. More than 1,300 employees currently work at the Endicott site, and the company will continue to increase its workforce to accommodate resulting business growth.
“We are building the future of power and energy management in the Greater Binghamton area,” said Ehtisham Siddiqui, vice president and general manager of Controls and Avionics Solutions at BAE Systems. “This expansion deepens our commitment to the region, while positioning us at the forefront of rising demand for aircraft electrification technology. By investing in local talent and advanced manufacturing, we are preparing to meet evolving customer needs and enabling the future of flight.”
The ESS facility will be completed over the next few years and will include pilot production lines for new product development maturation, fully automated high-volume manufacturing capability, a state-of-the-art engineering laboratory to test battery cells and energy storage systems, office space, and designated space for comprehensive aftermarket support. Work on the project has already begun.
A member of New Energy New York, BAE Systems collaborates with industry, academic, and government leaders to accelerate the energy storage development ecosystem in the Southern Tier through innovation and workforce development.
BAE Systems employees in Endicott innovate for a wide range of programs for commercial and military applications in air and on land, including flight controls, engine controls, mission systems, and power and propulsion solutions.
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.