Smarter Inspection, Greater Savings – Mek Brings AOI & ROI Insights to IPC APEX 2025
February 21, 2025 | Mek (Marantz Electronics)Estimated reading time: 2 minutes

Mek (Marantz Electronics), a global leader in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) systems, is excited to announce its participation in IPC APEX EXPO 2025, the largest electronics manufacturing event in North America. Taking place from March 18-20, 2025, at the Anaheim Convention Center, Mek will be exhibiting at Stand 1632, where visitors can explore the company’s latest AOI innovations, including the new PowerSpector JSAz 550 desktop AOI and the VeriSpector Assembly Station AOI, along with its recently launched ROI Calculator.
The new Mek PowerSpector JSAz 550 desktop AOI system features a completely redesigned chassis, including upgraded motors, drives, and spindles. While the optics and software remain consistent with MEK’s other desktop models, the new chassis design ensures that the JSAz 550 meets the demands of inspecting larger PCBs with efficiency and precision.
The latest release retains the ultimate flexibility of other Mek PowerSpector desktop AOI systems, known for high defect coverage and short programming times. PowerSpector remains the only desktop AOI solution on the market that can be equipped with nine cameras, offering unmatched inspection precision for manufacturers with space constraints. It is equipped with selective 3D laser measurement technology for precise height measurements and offers a versatile inspection engine capable of handling SMT and THT components.
In addition, Mek will highlight its VeriSpector AOI system, specifically designed for the inspection of Through-Hole Technology (THT) components before they enter wave or selective soldering processes. With inspection times of under five seconds, VeriSpector enables manufacturers to perform real-time assembly and placement checks, allowing for immediate repairs and defect prevention. The inline version of VeriSpector, which will be on display, ensures robust performance and compatibility with a range of automation options, making it a vital tool for enhancing the quality and efficiency of manual and semi-automatic assembly processes.
Mek will also present its new ROI Calculator, a powerful online tool that helps manufacturers assess the financial benefits of AOI investment. By entering key production data, such as operator wages, PCB output, and batch sizes, users can instantly calculate potential cost savings and return on investment. With full transparency, the tool allows manufacturers to see the true economic impact of transitioning from manual to automated inspection.
Visitors to Stand 1632 at IPC APEX will have the opportunity to see Mek’s advanced AOI systems in action and discover the tools they need to enhance inspection accuracy, reduce costs, and drive efficiency.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.