-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Hon Hai Research Institute Achieves Quantum Computing Breakthrough at QIP 2025
February 24, 2025 | Hon Hai Technology GroupEstimated reading time: 1 minute
Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, has announced another advancement in its forward-looking technology research and development at the Hon Hai Research Institute. The latest quantum fault-tolerant computing results from the Quantum Computing Institute of Hon Hai Research Institute have been accepted by the world's top quantum computing conference, QIP 2025 (the 28th Annual Quantum Information Processing Conference). This marks the fourth consecutive year that Hon Hai Research Institute has been honored by the prestigious QIP conference.
Ming-Hsiu Hsieh, Director of the Quantum Computing Institute at Hon Hai Research Institute, and Adam Wills, a master's researcher at the institute, teamed up with the University of Tokyo in Japan to achieve a major breakthrough in quantum fault-tolerant computing technology. The research results prove, for the first time, that the resource redundancy required for quantum fault-tolerant computing does not increase with the expansion of the system scale. This discovery is of great significance for the realization of large-scale quantum computing and will have a very positive impact on its development. Hon Hai Research Institute will deliver a keynote speech at the QIP 2025 Annual Conference to be held in Raleigh, North Carolina, USA.
In addition, Lin Dingjun, a doctoral intern at the Quantum Computing Institute of Hon Hai Research Institute, collaborated with the University of California, Berkeley to further promote the aforementioned results, using efficient quantum low-density parity-check codes (Quantum LDPC Codes) to achieve quantum fault-tolerant computing, further improving its feasibility and practicality. This outstanding research result also won the QIP 2025 Best Student Paper Award for two outstanding students involved in the research, Lin Dingjun and Adam Wills.
The technological breakthrough achieved by Hon Hai Research Institute will enable Taiwan to gain key influence in the field of quantum computing, and also proves that Hon Hai's continuous efforts and investment in the field of quantum computing have accumulated considerable technical capabilities. Hon Hai Research Institute will continue to focus on the research of quantum computing and make greater contributions to global technological innovation and industrial progress.
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.