Hon Hai Research Institute Achieves Quantum Computing Breakthrough at QIP 2025
February 24, 2025 | Hon Hai Technology GroupEstimated reading time: 1 minute
Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, has announced another advancement in its forward-looking technology research and development at the Hon Hai Research Institute. The latest quantum fault-tolerant computing results from the Quantum Computing Institute of Hon Hai Research Institute have been accepted by the world's top quantum computing conference, QIP 2025 (the 28th Annual Quantum Information Processing Conference). This marks the fourth consecutive year that Hon Hai Research Institute has been honored by the prestigious QIP conference.
Ming-Hsiu Hsieh, Director of the Quantum Computing Institute at Hon Hai Research Institute, and Adam Wills, a master's researcher at the institute, teamed up with the University of Tokyo in Japan to achieve a major breakthrough in quantum fault-tolerant computing technology. The research results prove, for the first time, that the resource redundancy required for quantum fault-tolerant computing does not increase with the expansion of the system scale. This discovery is of great significance for the realization of large-scale quantum computing and will have a very positive impact on its development. Hon Hai Research Institute will deliver a keynote speech at the QIP 2025 Annual Conference to be held in Raleigh, North Carolina, USA.
In addition, Lin Dingjun, a doctoral intern at the Quantum Computing Institute of Hon Hai Research Institute, collaborated with the University of California, Berkeley to further promote the aforementioned results, using efficient quantum low-density parity-check codes (Quantum LDPC Codes) to achieve quantum fault-tolerant computing, further improving its feasibility and practicality. This outstanding research result also won the QIP 2025 Best Student Paper Award for two outstanding students involved in the research, Lin Dingjun and Adam Wills.
The technological breakthrough achieved by Hon Hai Research Institute will enable Taiwan to gain key influence in the field of quantum computing, and also proves that Hon Hai's continuous efforts and investment in the field of quantum computing have accumulated considerable technical capabilities. Hon Hai Research Institute will continue to focus on the research of quantum computing and make greater contributions to global technological innovation and industrial progress.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
Teledyne FLIR Defense to Deliver Portable Chemical Detectors to US Customs and Border Protection
10/21/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has received an order from U.S. Customs and Border Protection (CBP) for 15 of its Griffin™ G510x portable chemical detectors, specifically designed to analyze and identify explosives and narcotics, such as fentanyl and nitazenes, within five minutes.
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.