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Koh Young America Appoints MaRC Technologies as its Sales Representative for the Pacific Northwest
February 25, 2025 | Koh YoungEstimated reading time: 1 minute

Koh Young America, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the addition of MaRC Technologies as its sales representative for the Pacific Northwest region, effective February 24, 2025.
MaRC Technologies, known for its expertise in providing advanced solutions to the electronics manufacturing industry, will support Koh Young’s expanding customer base across Oregon, Washington, Idaho, and Montana. The company brings extensive experience in surface mount technology (SMT) and process solutions, making them a strong partner in delivering Koh Young’s industry-leading inspection technologies to manufacturers in the region.
“We are excited to welcome MaRC Technologies to the Koh Young sales network,” said Allen Phung, Head of Sales at Koh Young America. “Their deep knowledge of SMT processes, combined with a commitment to customer success, aligns perfectly with our mission to provide innovative inspection and measurement solutions that drive process optimization and quality improvements.”
MaRC Technologies President Mike Gunderson expressed enthusiasm about the new partnership, stating, “We are thrilled to add Koh Young, the industry leader in True 3D measurement-based inspection and metrology, to our line card. Their innovative SPI and AOI technologies perfectly complement our existing solutions, enabling us to offer customers best-in-class process control and quality assurance tools. We look forward to working closely with the Koh Young team to support manufacturers in achieving their production goals.”
With a strong presence in the Pacific Northwest, MaRC Technologies will work closely with Koh Young America to support manufacturers seeking to improve yield, reliability, and efficiency through advanced inspection and metrology technologies.
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Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/20/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
Koh Young Appoints George Hsu to Lead Newly Opened Taiwan Office to Drive Semiconductor and Advanced Packaging Growth
08/18/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the appointment of George Hsu as Managing Director of Koh Young Taiwan, its newly established branch office in Zhubei City, Hsinchu County.
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium
08/12/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025.