Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
New Book Explores History of X-ray Technology and Application in Electronics Today
March 5, 2025 | I-Connect007Estimated reading time: Less than a minute
As the field of electronics continues to evolve, X-ray inspection has become an indispensable tool for ensuring quality and reliability in manufacturing processes. In The Printed Circuit Assembler’s Guide to... X-ray Inspection, author Dr. Bill Cardoso, Creative Electron, discusses the development of contemporary X-ray machines, which incorporate advanced imaging, motion, and decision-making steps that facilitate precise defect detection.
This unique book provides an in-depth exploration of X-ray technology, tracing its historical roots from Wilhelm Conrad Roentgen's 1895 discovery to its modern applications in electronics.
Peer reviewer Gary Korkala of Kodex, Inc., says, “The Printed Circuit Assembler's Guide to... X-Ray Inspection is a must-read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process.”
This essential resource is a valuable tool for engineers, inspectors, and manufacturers alike, equipping them with the knowledge needed to effectively use X-ray inspection in their production processes.
Now available from I-Connect007. Visit iconnect007.com/xi to get your free copy today.
I-Connect007 has published over 40 technical books. View our complete library here.
Share on:
Suggested Items
Driving Innovation: Registration in PCB Production Throughout the Process
05/05/2025 | Simon Khesin -- Column: Driving InnovationPCB manufacturing is a fascinating industry where multiple disciplines—chemical, mechanical, and optical processes—intersect. Each field plays a crucial role, and missing even one step can significantly impact production and yield. In the realm of mechanical and optical processes, one of the most critical aspects influencing the final result—especially in complex PCB designs—is registration.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
04/29/2025 | Mike Konrad -- Column: The Knowledge BaseFrom detecting voids under BGAs to solder defects in high-reliability applications, X-ray inspection has become an indispensable tool in modern manufacturing. But how is the technology evolving? What challenges do experts face in deploying X-ray inspection effectively and what does the future hold for this critical quality assurance method?
NASA Tests Ultralight Antennas to Benefit Future National Airspace
04/28/2025 | NASANASA engineers are using one of the world’s lightest solid materials to construct an antenna that could be embedded into the skin of an aircraft, creating a more aerodynamic and reliable communication solution for drones and other future air transportation options.
Altus Honours Scienscope with ‘Fastest Growing and Most Dynamic Supplier’ Award
04/22/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, has awarded Scienscope, a global provider of high-quality inspection equipment, with the ‘Fastest Growing and Most Dynamic Supplier’ recognition, celebrating their dynamic growth and innovative approach to electronics manufacturing solutions.