Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent

04/01/2025 | JCN Newswire
The European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.

IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce

03/14/2025 | Evelyn Cui, IPC Asia
In Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.

European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce

03/10/2025 | SEMI
The European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.

TPCA Thailand PCB Talent Matchmaking Conference Successfully Connects Industry and Academia

03/10/2025 | TPCA
The Taiwan Printed Circuit Association (TPCA) recently concluded its "International PCB Talent Matchmaking Conference" in Bangkok, Thailand, on March 5, 2025.

Synopsys Teams Up with SEMI Foundation to Drive Workforce Development Initiatives in Semiconductor Industry

02/20/2025 | SEMI
Synopsys, Inc. and the SEMI Foundation today announced the signing of a Memorandum of Understanding (MoU) at Synopsys’ corporate headquarters in Sunnyvale, Calif. to advance workforce development within the semiconductor chip design sector.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in