Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
Taiwan PCB Industry Poised for Growth Driven by AI and Satellite Communications
March 3, 2025 | TPCAEstimated reading time: 1 minute
The Taiwan Printed Circuit Association (TPCA), in collaboration with the Industrial Technology Research Institute's International Industrial Science and Technology Research Institute, released its latest report on the Taiwan circuit board industry during its "Trend Online Seminar" on February 26, 2025. The report highlighted that Taiwan's PCB industry achieved an output value of NT$816.8 billion in 2024, a 6.1% year-on-year increase. Growth was primarily driven by demand for AI servers, satellite communications, and automotive electronics. Looking ahead to 2025, the industry is projected to grow to NT$854.1 billion, a 4.6% increase. Continued demand for AI servers, edge AI applications, and low-orbit satellite PCBs are expected to fuel this growth.
The report also highlighted some key market trends. High-end HDI boards and multi-layer boards saw strong growth due to AI server and satellite communication demand. Automotive electronics demand remains robust, despite a slowing global auto market, and mobile phone boards continue to be a major product segment. Notably, server PCB output value increased by 49% in 2024, reaching NT$50.9 billion, and satellite PCB output value increased by 83% in 2024, reaching NT$19.3 billion. However, the flexible board market share declined due to stagnant mobile phone growth, and IC substrate market growth slowed but is expected to rebound with increased AI application adoption.
Despite the positive outlook, the industry faces challenges and uncertainties. US policy changes, including potential tariff adjustments and electric vehicle policy shifts, pose significant uncertainties. Deflation risks in mainland China could impact consumer market recovery. New production capacity in Thailand from Taiwanese and Chinese manufacturers may intensify price competition, and rising international gold prices and electricity costs may increase manufacturing expenses.
Overall, the Taiwan PCB industry is cautiously optimistic about 2025, with strong growth potential in AI server and satellite communication sectors. However, external factors such as US policy and global economic conditions require careful monitoring.
Share on:
Suggested Items
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
DuPont Achieves 100% Renewable Electricity Across its European Union Operations
05/28/2025 | DuPontDuPont announced 100 percent of its grid electricity is from renewable sources across its entire European Union (EU) operations, through the use of Renewable Energy Certificates (RECs).
NVIDIA Expected to Launch RTX PRO 6000 Special Edition for China’s AI Market, Potentially Boosting Future GDDR7 Demand
05/28/2025 | TrendForceTrendForce reports that following the new U.S. export restrictions announced in April—which require additional permits for the export of NVIDIA’s H20 or any chips with equivalent memory bandwidth or interconnect performance to China—NVIDIA is expected to release a special low-power, downscaled version of the RTX PRO 6000 (formerly B40) for the Chinese market.
CIMS to Exhibit at JPCA Show 2025
05/28/2025 | CIMSCIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.