-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TSMC Intends to Expand Its Investment in the United States to $165 Billion to Power the Future of AI
March 4, 2025 | TSMCEstimated reading time: 1 minute
TSMC announced its intention to expand its investment in advanced semiconductor manufacturing in the United States by an additional $100 billion. Building on the company’s ongoing $65 billion investment in its advanced semiconductor manufacturing operations in Phoenix, Arizona, TSMC’s total investment in the U.S. is expected to reach US$165 billion. The expansion includes plans for three new fabrication plants, two advanced packaging facilities and a major R&D team center, solidifying this project as the largest single foreign direct investment in U.S. history.
Through this expansion, TSMC expects to create hundreds of billions of dollars in semiconductor value for AI and other cutting-edge applications. TSMC’s expanded investment is expected to support 40,000 construction jobs over the next four years and create tens of thousands of high-paying, high-tech jobs in advanced chip manufacturing and R&D. It is also expected to drive more than $200 billion of indirect economic output in Arizona and across the United States in the next decade. This move underscores TSMC’s dedication to supporting its customers, including America’s leading AI and technology innovation companies such as Apple, NVIDIA, AMD, Broadcom, and Qualcomm.
“Back in 2020, thanks to President Trump’s vision and support, we embarked on our journey of establishing advanced chip manufacturing in the United States. This vision is now a reality," said TSMC Chairman and CEO Dr. C.C. Wei. “AI is reshaping our daily lives and semiconductor technology is the foundation for new capabilities and applications. With the success of our first fab in Arizona, along with needed government support and strong customer partnerships, we intend to expand our U.S. semiconductor manufacturing investment by an additional $100 billion, bringing our total planned investment to $165 billion.”
TSMC's Arizona fab currently employs more than 3,000 people on 1,100 acres of land in Arizona. The site has been in volume production since late 2024. This expansion will play a crucial role in strengthening the U.S. semiconductor ecosystem by increasing American production of advanced semiconductor technology. It will also complete the domestic AI supply chain with TSMC’s first U.S. advanced packaging investments.
In the United States, in addition to its latest manufacturing site in Phoenix, TSMC operates a fab in Camas, Washington, and design service centers in Austin, Texas, and San Jose, California.
Suggested Items
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Roke, Kaigai Expand Partnership to Deliver Cutting-Edge Electromagnetic Warfare and AI Surveillance to Japanese Defence Market
05/26/2025 | RokeRoke, a UK company that stands at the forefront of defence and security, and Kaigai Corporation have announced an expansion of their strategic partnership, significantly increasing the availability of Roke’s cutting-edge products and services to the Japanese market.
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
05/26/2025 | ClassOne TechnologyClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.
STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology
05/22/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in collaboration with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, announces the expansion of the “Lab-in-Fab” (LiF) in Singapore.
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
05/22/2025 | GlobalFoundriesGlobalFoundries (GF) announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.