-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Strengthens Its Global Executive Leadership Team
March 4, 2025 | IPCEstimated reading time: 2 minutes
In an effort to strengthen service to its more than 3,200 corporate global members, IPC announces the transition of two of its executive leadership staff into new IPC roles. Matt Kelly, who most recently served as IPC’s vice president of technology solutions, has assumed the role of vice president of standards & technology and remains chief technology officer (CTO). David Bergman, IPC’s longest tenured employee who served as IPC’s standards & technology vice president, has taken on the role of vice president of international relations.
As CTO and vice president of standards & technology, Kelly will now lead both technology solutions and standards groups. Within the standards group, he will develop and implement strategic objectives strengthening IPC standards offerings. He will provide direction and leadership toward achieving the organization’s mission to ensure IPC standards remain at the forefront of the global electronics industry. In addition, Kelly and the technology solutions group will continue to strengthen the industry in the areas of advanced electronic packaging, next generation design, and digital manufacturing. By collaborating with industry, Kelly and the solutions group will provide industry leading thought leadership, develop new guidelines and standards, and recommend new education/training solutions.
As vice president of international relations, Bergman is responsible for expanding and strengthening the organization's global presence, fostering international partnerships, and advocating for the electronics manufacturing industry. His key responsibilities include global expansion of strategic initiatives, market development and member engagement, event and conference representation and leadership and team development of IPC’s regional teams. Bergman will continue his term as World Electronics Circuits Council (WECC) secretary general as well as executive director of the Wiring Harness Manufacturer’s Association (WHMA).
“Matt is widely recognized in the global electronics industry as a premier thought leader and innovator. As CTO, he and his group helped define and achieve a portfolio of “factory of the future” standards and technical research; he has become a trusted advisor to governments for advanced packaging; driving a silicon to systems approach for the industry; and created and launched an Industry Chief Technologist Council that has produced numerous thought-leadership reports,” said John W. Mitchell IPC president and CEO.
Mitchell continued, “Earlier in David’s IPC career, he held responsibilities for international relations and helped establish IPC operations in China, India, Malaysia and Europe. Now based in Southeast Asia, his vast experience in international business development, coupled with his expertise in strengthening IPC’s global presence makes sense for him to serve as international relations lead. This executive leadership transition further cements IPC’s role as the leading global electronics association.”
Kelly can be reached at MattKelly@ipc.org and Bergman can be reached at DavidBergman@ipc.org.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Japan’s Voice in Global Electronics Standards: Inside the 7-31BV-JP Task Group
11/27/2025 | Norihito Suzuki, Tokai RikaTokai Rika’s journey toward adopting IPC standards for automotive electronic assemblies was long and complex, taking about a decade to complete. Traditionally, Japanese automotive electronics manufacturers relied on domestic or in-house standards, often differing from overseas suppliers. These differences created significant barriers in global procurement, making it harder to source parts from IPC-compliant overseas suppliers and creating cost inefficiencies due to duplicate testing and process requirements.
Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025
11/17/2025 | Sydney Xiao, Global Electronics Association East AsiaDiscussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
Caught in the ESG Crossfire: Transparency, Comparability, and Impact
10/31/2025 | Marina Hornasek-Metzl, AT&S AGIn the evolving landscape of corporate responsibility, Environmental, Social, and Governance (ESG) reporting has become a cornerstone of stakeholder communication. Yet, as organizations strive to meet growing regulatory and investor demands, they find themselves caught between the need for robust ESG disclosure, the persistent lack of comparability across reports, and the elusive goal of translating ESG efforts into tangible business value.
Fall 2025 Issue of Community Magazine Now Available
10/20/2025 | I-Connect007Now available! The Fall 2025 issue of Community Magazine delivers another stellar issue packed with member profiles, workforce development and sustainability wins, policy updates, factory data standards, personality features, news from around the world, and much more..