Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Japan’s Voice in Global Electronics Standards: Inside the 7-31BV-JP Task Group

11/27/2025 | Norihito Suzuki, Tokai Rika
Tokai Rika’s journey toward adopting IPC standards for automotive electronic assemblies was long and complex, taking about a decade to complete. Traditionally, Japanese automotive electronics manufacturers relied on domestic or in-house standards, often differing from overseas suppliers. These differences created significant barriers in global procurement, making it harder to source parts from IPC-compliant overseas suppliers and creating cost inefficiencies due to duplicate testing and process requirements.

Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025

11/17/2025 | Sydney Xiao, Global Electronics Association East Asia
Discussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.

Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix

11/03/2025 | Real Time with...SMTAI
Marcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.

Caught in the ESG Crossfire: Transparency, Comparability, and Impact

10/31/2025 | Marina Hornasek-Metzl, AT&S AG
In the evolving landscape of corporate responsibility, Environmental, Social, and Governance (ESG) reporting has become a cornerstone of stakeholder communication. Yet, as organizations strive to meet growing regulatory and investor demands, they find themselves caught between the need for robust ESG disclosure, the persistent lack of comparability across reports, and the elusive goal of translating ESG efforts into tangible business value.

Fall 2025 Issue of Community Magazine Now Available

10/20/2025 | I-Connect007
Now available! The Fall 2025 issue of Community Magazine delivers another stellar issue packed with member profiles, workforce development and sustainability wins, policy updates, factory data standards, personality features, news from around the world, and much more..
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in