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Advanced Electronics Packaging Digest

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Incap Slovakia Joins Slovak Security and Defence Industry Association

05/28/2026 | Incap
Incap Electronics Slovakia has joined the Slovak Security and Defence Industry Association (ZBOP), further strengthening Incap’s focus on electronics manufacturing for high-reliability and regulated industries, including the defence and security sector.

Incap Germany at European Defence Supply 2026

05/26/2026 | Incap
European Defence Supply 2026 in Munich brought together industry representatives, technology providers, authorities and defence stakeholders to discuss the future of European defence supply chains, industrial resilience and scalable manufacturing capabilities for security-critical applications.

Marcy’s Musings: Additive Processes, Signal Consequences

05/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Signal integrity and additive manufacturing, particularly in metallization, are defining themes in modern PCB design and fabrication. PCB layouts are meticulously engineered systems designed to meet strict electrical and power performance targets. However, achieving those targets does not end at the design stage. Once a design enters fabrication, metallization processes—the precise plating of conductive traces—play a critical role in ensuring that signal speed, reliability, and integrity are achieved in the final physical board.

Incap India Invests in Testing and SMT Upgrades to Scale Production

05/15/2026 | Incap
Incap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory.

Flex Plans Cloud and Power Unit Spin-Off

05/08/2026 | Flex
Flex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
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