-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
UHDI Fundamentals: UHDI Advances Neurotechnology
March 5, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute

Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains:
Dense Electrode Arrays
UHDI technology is a game-changer for dense electrode arrays used in neurotechnology and neuroscience research. These arrays are critical for applications such as neural recording, stimulation, and mapping, where precision and miniaturization are paramount.
- Higher spatial resolution: UHDI facilitates the design of densely packed interconnects for neural electrode arrays, enabling more precise detection and stimulation of neural signals.
- Improved signal quality: The reduced impedance and enhanced connectivity ensure cleaner signal acquisition, critical for high-fidelity neural recording.
Applications:
- Brain signal mapping for neuroscience research
- Prosthetic control through detailed neural activity monitoring
To read the rest of this article in the February 2025 issue of Design007 Magazine, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
04/23/2025 | PRNewswireCeva, Inc., the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced that Nextchip has licensed the NeuPro-M Edge AI Neural Processing Unit (NPU) IP for its next-generation advanced driver assistance systems (ADAS) solutions.
Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces
02/28/2025 | PRNewswireNeural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.
Delvitech Expands Into Microelectronics and Chiplet Segments
01/23/2025 | DelvitechDelvitech, a global leader in AI-driven optical inspection technology, is proud to announce its strategic expansion into the microelectronics and chiplet sectors.
STMicroelectronics to Boost AI at the Edge with New NPU-Accelerated STM32 Microcontrollers
12/11/2024 | STMicroelectronicsSTMicroelectronics, is making embedded artificial intelligence (AI) truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine-learning (ML) capabilities.