SEMICON China 2025 to Highlight Key Opportunities and Challenges in Advancing Semiconductor Industry Growth
March 7, 2025 | SEMIEstimated reading time: 2 minutes
SEMICON China 2025 will gather industry visionaries and leaders from March 26-28 at the Shanghai New International Expo Centre to delve into the latest developments, trends, and innovations in key areas crucial for propelling industry growth to $1 trillion by 2030. Thought leaders from across the globe will address central themes including smart manufacturing, heterogenous integration, compound semiconductor, design, display, sustainability, and workforce development. Registration is open.
SEMICON China 2025 will feature 1,300 exhibitors and more than 5,000 booths in 100,000 square meters of exhibit space – matching last year’s record highs – with the exhibition and conferences addressing issues spanning the electronics supply chain including chip design, manufacturing, assembly and test, equipment and materials, photovoltaic and display.
SEMICON China 2025 Highlights
Grand Opening Keynotes
- Jeong-kee Kim, Secretary-General, World Smart Sustainable Cities Organization (WeGO)
- Peng Bai, Executive Director and President, Hua Hong Semiconductor Limited
- Sheng Liu, Academician, Wuhan University
- Li Zheng, Chief Executive Officer, JCET Group
- Akihisa Sekiguchi, Fellow, Tokyo Electron Limited
- Lim Choon Khoon, CEO, Advanced Packaging, Semiconductor Solutions, ASMPT
Innovation and Investment
- SEMI Industry Strategy Symposium (ISS): SEMI Innovation and Investment Forum – Experts will explore technological trends shaping semiconductor innovation, addressing global economics, trade, and semiconductor supply chain challenges.
- Design Innovation Forum – AI Intelligent Applications and Automotive ICs – Leading IC design and supply chain companies will share insights into emerging technologies, automotive trends, and related opportunities and challenges.
IC Manufacturing Technology and Supply Chain
- Advanced Material Conference (AMC) – Global experts will discuss current developments and future trends in advanced materials.
- IC Manufacturing Supply Chain International Conference – Thought leaders will share their latest research and developments in semiconductor equipment and processes, ranging from component supply to equipment manufacturing, system upgrades and process optimization.
- Heterogeneous Integration (Advanced Packaging) International Conference (HIIC) – Global leaders from the advanced packaging ecosystem will share perspectives on the current state of advanced packaging and challenges for heterogeneous integration and chiplets.
- Green High-Tech Facility International Innovation Forum – Presenters will address topics including energy management, super bubbler WAC-PV, leading cleanroom solutions, and semiconductor plant energy management leveraging AI.
- Smart Manufacturing Forum – Factory of the Future – Speakers in electronic design automation (EDA), software, hardware, equipment and plant management will share their insights on the development of smart factories.
- New Technology Release Conference – This session showcases disruptive technologies and innovations, including advanced manufacturing processes, high-performance chip design, smart manufacturing, and sustainable materials.
Compound Semiconductor Asia Conference (CS Asia) 2025
- This three-day program will focus on topics including power and compound semiconductor, and emerging power device technologies.
- SCC Sustainability and Environmental, Social and Governance (ESG) Summit Forum
- Experts will explore low-carbon solutions, ESG, dual carbon goals, and sustainable semiconductor practices supported by the Semiconductor Climate Consortium (SCC).
Display on Silicon
- CDC Metaverse – Display on Silicon – Topics include AI+AR glasses ecosystem building; silicon-based display tech roadmaps; core process, equipment and materials innovation; industry and market trend outlook.
Workforce Development
- SEMI Workforce CXO Talent Forum – Speakers from industry and academia will explore the talent issues in China and provide strategies for future workforce development initiatives.
Conference of Science & Technology for Integrated Circuits (CSTIC)
- CSTIC 2025, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia, will be held March 24-25 in conjunction with SEMICON China 2025. Organized by SEMI and IEEE, CSTIC 2025 will feature 10 symposia covering all aspects of semiconductor technology.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.