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Advanced Electronics Packaging Digest

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Teradyne Introduces Titan HP Platform for AI Data Center Devices

10/06/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced a production-ready system that delivers enhanced burn-in capabilities on its Titan™ HP platform.

GSME, Teradyne Announce Strategic Partnership

09/23/2026 | PRNewswire
GS Microelectronics U.S., Inc., a fast-growing semiconductor solutions provider, and Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, today announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market.

Teradyne Introduces Iris 100 MicroLED Test System

09/21/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced Iris 100, a production-ready optical test platform for microLED devices.

Teradyne Reports New Record High in Q1 2026

04/30/2026 | BUSINESS WIRE
Teradyne, Inc. reported revenue of $1,282 million for the first quarter of 2026 of which $1,111 million was in Semiconductor Test, $91 million in Robotics, and $80 million in Product Test. GAAP net income for the first quarter of 2026 was $398.9 million, or $2.53 per diluted share.

Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation

04/22/2026 | PRNewswire
Flex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing.
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