I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 7, 2025 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we? So, how do you recover?
IPC APEX EXPO takes place in Anaheim, California, March 18-20, and we’ll be there from ribbon-cutting through the final announcement telling everyone that the show is closed. We’ll be bringing you Real Time with… video interviews with the movers and shakers in PCB design, fabrication, assembly, and test. I’ll be glad to get out of Atlanta—it’s freezing here.
If you’re at the IPC show, stop by our booth and say hello. In the meantime, have a good weekend.
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
Published March 5
PCB007 Editor Marcy LaRont brings us this review of the first day’s events at the IMAPS Device Packaging Conference in Phoenix this week. As she explains, there was a lot of attention paid to AI and advanced packaging substrates, including glass. I understand the appeal of glass at the packaging level. I’ve heard some PCB fabricators discuss using glass; has anyone on the PCB side ever utilized glass?
UHDI Fundamentals: UHDI Advances Neurotechnology
Published March 5
If you’ve been following Anaya Vardya’s UHDI series, you’re aware that his new technology is a real game-changer. In this installment, Anaya explains how UHDI figures into the development of neurotechnology, especially brain-computer interfaces (BCI). It’s a brave new world for UHDI, and the innovation is only getting started.
Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO
Published March 6
Summit Interconnect has new leadership now, with COO Sean Patterson becoming the company’s first CTO. Michael Norman joins Summit from Raytheon, becoming president and COO. Shane Whiteside will continue as CEO and chairman of the board.
It’s Only Common Sense: Follow Through and Keep Your Promises
Published March 3
Dan Beaulieu really nails it this week: We work in a blizzard of emails and texts, so following up is a real necessity. There’s really no excuse for failing to follow up, and we’re all guilty of this at one time or another. But we all know which of our friends, customers, and suppliers are the most likely to follow up, and they’re the ones we tend to want to deal with. Dan says, “Following through on promises isn’t a common trait.” I’d like to disagree, but he may be right. Check it out.
Recruiting the Next Generation of PCB Designers at Garmin
Published March 6
It’s no secret that we’re running out of PCB designers and design engineers. There are open PCB design jobs around the globe, and there aren’t enough designers to fill these jobs. In this interview, Garmin’s design engineering manager, LB Yates, explains the company’s plans to recruit and train the next generation of PCB designers.
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Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia
07/30/2025 | TPCAAs the global supply chain continues to restructure, Southeast Asia, leveraging its geographical advantages and favorable policies, has become a strategic hub for global circuit board manufacturing.