-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
UHDI Fundamentals: UHDI Advances Neurotechnology
March 5, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute
Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains:
Dense Electrode Arrays
UHDI technology is a game-changer for dense electrode arrays used in neurotechnology and neuroscience research. These arrays are critical for applications such as neural recording, stimulation, and mapping, where precision and miniaturization are paramount.
- Higher spatial resolution: UHDI facilitates the design of densely packed interconnects for neural electrode arrays, enabling more precise detection and stimulation of neural signals.
- Improved signal quality: The reduced impedance and enhanced connectivity ensure cleaner signal acquisition, critical for high-fidelity neural recording.
Applications:
- Brain signal mapping for neuroscience research
- Prosthetic control through detailed neural activity monitoring
To read the rest of this article in the February 2025 issue of Design007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
STMicroelectronics Unveils First Automotive MCU with Built-In AI Acceleration
02/20/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration for automotive edge intelligence.
STMicroelectronics Launches First Automotive AI-Accelerated Edge Microcontroller
02/13/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration for automotive edge intelligence.
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
04/23/2025 | PRNewswireCeva, Inc., the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced that Nextchip has licensed the NeuPro-M Edge AI Neural Processing Unit (NPU) IP for its next-generation advanced driver assistance systems (ADAS) solutions.
Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces
02/28/2025 | PRNewswireNeural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.