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European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce
March 10, 2025 | SEMIEstimated reading time: 1 minute
The European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.
Hosted at Dublin City University, Future Proofing Access to Diverse Talent in the Semiconductor Industry will bring together industry leaders, researchers, and professionals to foster meaningful dialogue and actionable strategies for building a more sustainable workforce.
“This event is a crucial bringing together of key stakeholders, to align talent strategies with broader economic and policy goals, ensuring Europe’s semiconductor ecosystem remains globally competitive,” said Laith Altimime, President of SEMI Europe.
As the demand for skilled professionals in microelectronics continues to surge, the challenge of filling open roles persists. A study by ManpowerGroup showed that 77% of employers globally report difficulties in hiring, while 57% of consumers express loyalty to socially responsible companies according to Deloitte. Addressing these issues requires a proactive approach to workforce development that prioritizes inclusion and equitable opportunities for all talent.
The event will feature discussions and presentations from distinguished industry and academic leaders, exploring the latest research on workforce diversity and practical strategies for fostering inclusion. Experts will share real-world case studies on successful workforce development initiatives and engage attendees in interactive sessions designed to equip them with tools for driving meaningful change within their organizations.
“Diversity plays a crucial role in fostering creativity and problem-solving,” said Nessa Maguire, Director at EudaOrg. “Inclusive teams bring varied perspectives, leading to breakthrough technologies and more resilient supply chains.”
This gathering highlights the semiconductor industry’s commitment to not only attracting but also retaining the next generation of talent. Future-Proofing Access to Diverse Talent in the Semiconductor Industry will take place on March 27, 2025, at Dublin City University’s St Patrick’s Campus.
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Brent Fischthal - Koh YoungSuggested Items
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.